ACM Research Receives Orders for Wafer-Level Packaging Tools from US Customer and R&D Center

FREMONT, Calif., Sept. 04, 2024 (GLOBE NEWSWIRE) — ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading provider of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced that it has received orders for four wafer-level packaging tools, including two from a U.S. customer and two from a U.S. research and development (R&D) center.

“We are pleased to receive these strategic orders from both a U.S. customer and a leading U.S. research center,” said Dr. David Wang, President and Chief Executive Officer of ACM. “We believe these orders demonstrate the breadth of our advanced wafer level packaging tools, validate ACM’s commitment to innovation in semiconductor manufacturing, and underscore the growing traction among U.S. customers.”