EQS-News: SUSS MicroTec signs long-term lease for new production location in Taiwan | 04.11.24

• The new production location in Zhubei lays the foundation for further targeted growth in the coming years
• The production capacity doubles to 6,300 square meters
• No direct impact on German production locations

Garching, November 4, 2024 – SUSS MicroTec, a leading manufacturer of equipment and process solutions for the semiconductor industry, has signed a long-term lease agreement for a new manufacturing site in Zhubei (Hsinchu County, Taiwan). The new location is approximately 10 kilometers away from the previous production facility and will create new production capacity over a usable area of ​​18,000 square meters to meet the continued high demand for SUSS MicroTec solutions. Approximately 6,300 square meters will be devoted to production under cleanroom conditions.

New location increases flexibility and creates capacity for further targeted growth in the key region

With a recent share of approximately 80% of order intake, Asia/Pacific is SUSS MicroTec’s most important sales region. SUSS MicroTec opened the Science Park Hsinchu location in 2020 to leverage the potential of the region’s high-tech ecosystem with highly skilled specialists close to strategic customers. Within four years, the location has grown from 55 to 350 employees and has now reached its capacity limit. “Recently, we have repeatedly had to rent new space for administrative and operational functions to expand production capacity under cleanroom conditions at our current location. We want to create additional capacity at the new, larger location for further targeted growth,” says Dr. Thomas Rohe, COO of SUSS MicroTec SE, explaining the decision for the new location.

SUSS MicroTec has been producing coaters in Hsinchu since the opening of the location. The production of UV projection scanners followed in 2021. Most recently, in 2023, production of temporary bonders started. Temporary bonds play an important role in the production of high-performance memory chips, known as high-bandwidth memory (HBM). These memory chips are an important component for AI chips and are currently in high demand. The temporary bonder is also used in the industry-leading packaging process for AI chip modules. “The potential doubling of our production capacity in Taiwan will not only help us meet today’s high demand, but will also increase our flexibility to respond to further increases in customer demand in the future,” said Dr. Thomas Rohe.

Fast project realization, investment volume of € 15 to 20 million

Completion of the shell of the new location is scheduled for December 2024. SUSS MicroTec will then carry out the cleanroom and office installations in order to start production at the new location in the second half of 2025.

“In 2025, we expect an investment volume of €15 to 20 million for building and workplace equipment and the installation of new cleanroom infrastructure,” says Dr. Cornelia Ballwiesser, CFO of SUSS MicroTec.

Germany remains an important location for production and R&D

The capacity expansion in Taiwan has no direct impact on production in Germany at the Garching and Sternenfels locations. Mask aligners, solutions for the production and cleaning of photo masks and various bonders will continue to be manufactured there. The existing research and development activities also remain in Germany, where SUSS MicroTec currently has approximately 170 open vacancies. “Experts predict significant growth in the global semiconductor industry in the coming years. As a supplier to the world’s leading chip manufacturers, we want to benefit from this. The expansion of the Taiwan facility is an important milestone in preparing our company for future growth, but does not rule out further expansion of our activities in Europe and especially in Germany,” explains Burkhardt Frick, CEO of SUSS MicroTec SE.

Media contact:
Sven Koepsel
Vice President of Investor Relations and Communications
Email: [email protected]
Tel.: +49 89 32007151

About SUSS MicroTec

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close collaboration with research institutes and industrial partners, SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D integration and nano-imprint lithography, as well as key processes for MEMS and LED manufacturing. With a global application and service infrastructure, SUSS MicroTec supports more than 8,000 installed systems worldwide. SUSS MicroTec is headquartered in Garching, near Munich, Germany. The shares of SUSS MicroTec SE are traded on the Prime Standard of the German Stock Exchange (ISIN DE000A10K0235). For more information, please visit http://www.suss.com.

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