Teledyne unveils first 16k TDI line scan camera with 1 megahertz line frequency

WATERLOO, Canada, Sept. 17, 2024 (GLOBE NEWSWIRE) — Teledyne DALSA, a Teledyne Technologies (NYSE:TDY) company, is pleased to introduce the Linea HS2 TDI line scan camera family. This innovative camera series is built on more than four decades of industry-leading expertise and represents a major breakthrough in next-generation TDI technology. Designed for ultra-fast imaging in low-light conditions, it delivers exceptional image quality with 16k/5 µm resolution and features an industry-leading maximum line rate of 1 Megahertz or 16 Gigapixels per second data throughput.

The Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimized Quantum Efficiency, meeting the stringent requirements of current and future machine vision applications. The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximized line rate, dynamic range or full well, depending on specific application requirements. This makes it particularly ideal for inspecting semiconductor wafers, high density interconnects and flat panel displays, as well as for life science applications. On-chip binning also enables higher web speeds to increase system throughput. The camera is equipped with dual Camera Link HS CX4 connectors to active optical cables, providing full EMI immunity.